Continuous use temperature is 260℃ ,and heat distortion temperature is 380℃.Because the material has no melting point,it can be used at up to about 500℃ for short periods.

Excellent abrasion resistance in particular to sliding abrasion under high temperatures makes the material a standout among other super engineering plastic.

low impurities content and extremely low outgassing.

superior resisitance to chemicals,radiation,and plasma allows extensive use in semiconductor etching equipment and similar applications.

Standard Sizes

Details

• PI-330: low temperature thermosetting PI pure powder hot pressing material
• PI-350: medium temperature resistant thermosetting PI pure powder hot pressed material.
• PI-380: high temperature thermosetting PI pure powder hot pressing material
• PI-330-21:15% graphite modified low-temperature thermosetting PI pure powder hot pressed material
• PI-350-21:15% graphite modified medium temperature resistant thermosetting PI pure powder hot pressed material.

• PI-380-21: 15% graphite modified high temperature thermosetting PI pure powder hot pressing material

 Used for
• Semiconductor and material handling machinery
• Chip test sockets
• Wafer clamping rings
• Valve seats and sealing applications
• Spline couplings
• High performance bearings and bushings
• Locking fasteners for aerospace
• Pivot bushings on unison ring